Conductive Sponge
This product utilises polyurethane foam sponge as its base material, which undergoes PVD conductive treatment and thickening processes involving the electroplating of metals such as nickel and copper. This ensures conductivity throughout all dimensions of the sponge. The product possesses sound-absorbing and noise-reducing properties, whilst also offering shielding against electromagnetic radiation.
keywords:
Category:
Noise Reduction & Sound Damping
Product Application:
The material is soft, lightweight, and exhibits excellent resilience, available in multiple thicknesses for convenient and rapid processing into various specifications. It is employed for EMI (electromagnetic interference) shielding, ESD (electrostatic discharge) grounding, and other applications, suitable for manufacturing diverse I/O interfaces, gaskets, LCD cushions, and other purposes.
Currently, the product is extensively utilised in plasma televisions, liquid crystal displays, LCD televisions, mobile phones, communication equipment, medical instruments, and military and aerospace sectors.
Product Specifications:
| Nickel foam technical parameter table | |||||
| parameter | unit | illustrate | |||
| Number of holes (PPI) | 10~50 | 50~100 | 100~150 | PPI | Number of holes/inch |
| aperture | mm | ||||
| Material | May contain trace impurities (e.g., C, S) | ||||
| Types of structures | Three-dimensional porosity | Opening rate> 95% | |||
| thickness | 2.0~10 | 1.4~5.0 | 0.6~3.0 | mm | Commonly used 1.0mm, 1.5mm, 2.0mm |
| Areal density | ≥600 | ≥350 | ≥280 | g/m² | Related to thickness and porosity |
| Body density | g/cm³ | Apparent density (much lower than nickel solid density 8.9 g/cm³) | |||
| Porosity | % | Volume ratio (key parameter for high specific surface area) | |||
| Specific surface area | m²/g | Depends on pore size and structure | |||
| Surface resistance | S/m | Affected by porosity and structure | |||
| Vertical resistance | S/m | Affected by porosity and structure | |||
| tensile strength | MPa | Increases with increasing thickness | |||
| Elongation | |||||
| Withstand temperature | ℃ | It is easy to oxidize at high temperatures | |||
| Corrosion resistance | It is easy to corrode in acidic environments | ||||
| Flexibility | The degree of bendability | ||||
| permeability | Suitable for fluid/gas diffusion | ||||
| Shielding efficiency | db | ||||
CONTACT US
Address
No.1, Road 2, Industrial Zone, Wuzhou city, Guangxi, China
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Wide Range of Applications
Committed to becoming a specialized manufacturer of advanced new materials for high-tech electronic products, featuring professional niche expertise and international influence. Our focus includes conductive materials, thermal interface materials, electromagnetic shielding materials, electrode carriers, and materials for the new energy sector.
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Noise Reduction
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About HGP
The company specializes in research across multiple fields, including electromagnetic shielding, insulation protection, and heat dissipation materials for high-tech electronic products; new electrode materials for nickel-metal hydride, nickel-zinc, and lithium batteries; porous metal materials for filtration and heat dissipation; and new electrode materials for electrolytic hydrogen production. Additionally, it develops technologies such as roll-to-roll vacuum plasma treatment, vacuum deposition, electrodeposition, and precision coating. The company provides professional solutions and custom development of technologies and equipment for the aforementioned fields.
Best-Selling Products
The company specializes in research across multiple fields, including: - New materials for electromagnetic shielding, insulation protection, and thermal dissipation in high-tech electronic products - New electrode materials for nickel-metal hydride, nickel-zinc, and lithium batteries - Porous metallic materials for filtration and heat dissipation - New electrode materials for hydrogen production via water electrolysis
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