Conductive Fabric
This product utilises a polyester triangular profiled filament (50d×50d) lightweight spun yarn with a 36f thread count as its fabric substrate. Employing a vacuum deposition method, Ni-Cu metallic film layers are sequentially deposited, followed by electroplating to successively deposit Ni-Cu-Ni layers, thereby forming a composite metallic film system comprising five metallic layers. The product exhibits excellent metallic film adhesion, superior curing properties, and high electromagnetic shielding effectiveness.
keywords:
Category:
Electromagnetic Shielding
Product Application:
This product is extensively applicable in electromagnetic shielding, anti-static protection, and grounding scenarios. It serves electronic products such as smartphones, wearable devices, liquid crystal displays, automated high-frequency equipment, and medical instruments, as well as military and aerospace sectors.
Product Specifications:
| Nickel foam technical parameter table | |||||
| parameter | unit | illustrate | |||
| Number of holes (PPI) | 10～50 | 50～100 | 100～150 | PPI | Number of holes/inch |
| aperture | mm | ||||
| Material | May contain trace impurities (e.g., C, S) | ||||
| Types of structures | Three-dimensional porosity | Opening rate> 95% | |||
| thickness | 2.0～10 | 1.4～5.0 | 0.6～3.0 | mm | Commonly used 1.0mm, 1.5mm, 2.0mm |
| Areal density | ≥600 | ≥350 | ≥280 | g/m² | Related to thickness and porosity |
| Body density | g/cm³ | Apparent density (much lower than nickel solid density 8.9 g/cm³) | |||
| Porosity | % | Volume ratio (key parameter for high specific surface area) | |||
| Specific surface area | m²/g | Depends on pore size and structure | |||
| Surface resistance | S/m | Affected by porosity and structure | |||
| Vertical resistance | S/m | Affected by porosity and structure | |||
| tensile strength | MPa | Increases with increasing thickness | |||
| Elongation | |||||
| Withstand temperature | ℃ | It is easy to oxidize at high temperatures | |||
| Corrosion resistance | It is easy to corrode in acidic environments | ||||
| Flexibility | The degree of bendability | ||||
| permeability | Suitable for fluid/gas diffusion | ||||
| Shielding efficiency | db | ||||
CONTACT US
Address
No.1, Road 2, Industrial Zone, Wuzhou city, Guangxi, China
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Wide Range of Applications
Committed to becoming a specialized manufacturer of advanced new materials for high-tech electronic products, featuring professional niche expertise and international influence. Our focus includes conductive materials, thermal interface materials, electromagnetic shielding materials, electrode carriers, and materials for the new energy sector.
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About HGP
The company specializes in research across multiple fields, including electromagnetic shielding, insulation protection, and heat dissipation materials for high-tech electronic products; new electrode materials for nickel-metal hydride, nickel-zinc, and lithium batteries; porous metal materials for filtration and heat dissipation; and new electrode materials for electrolytic hydrogen production. Additionally, it develops technologies such as roll-to-roll vacuum plasma treatment, vacuum deposition, electrodeposition, and precision coating. The company provides professional solutions and custom development of technologies and equipment for the aforementioned fields.
Best-Selling Products
The company specializes in research across multiple fields, including: - New materials for electromagnetic shielding, insulation protection, and thermal dissipation in high-tech electronic products - New electrode materials for nickel-metal hydride, nickel-zinc, and lithium batteries - Porous metallic materials for filtration and heat dissipation - New electrode materials for hydrogen production via water electrolysis
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CONTACT US
No.1, Road 2, Industrial Zone, Wuzhou city, Guangxi, China
marketing@hgptech.com：
008618107740701：
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