Foamed Copper: Porous Conductive Technology Upgrade Assists Water Electrolysis Hydrogen Production and Heat Dissipation Fields

The application demand for porous metal materials in energy conversion and electronic heat dissipation fields continues to grow. With the advantages of high conductivity and porous structure, foamed copper is expanding its application scenarios through technological upgrading. Traditional foamed copper has problems such as low mechanical strength and easy surface oxidation. The new generation of products has achieved adaptation in multiple fields through production process and performance optimization.

The core technology in the production and manufacturing process lies in "electrodeposition process optimization + surface anti-oxidation treatment". Foamed copper is prepared by direct current electrodeposition process. By adjusting parameters such as electrolyte composition and current density, a porous structure with a porosity of 85%-98% and a pore size of 50-300μm is prepared to ensure that the material has excellent conductivity and fluid permeability; then, a protective film (such as nickel layer, chromium layer) is formed on the surface of foamed copper by chemical passivation or electroplating technology to enhance the oxidation resistance and corrosion resistance of the material and prolong the service life of the product in electrolyte and humid environments. In addition, a heat treatment process is introduced in the production process to improve the mechanical strength of foamed copper, making its compressive strength reach 1-5MPa, meeting the mechanical requirements of equipment assembly.

In terms of performance characteristics, the upgraded foamed copper has three advantages: "high conductivity, high porosity, and high heat dissipation". The volume resistivity is as low as 0.05-0.2mΩ·cm, and the conductivity is close to that of pure copper; the high porosity provides sufficient space for fluid transmission and electrochemical reactions; at the same time, it has good thermal conductivity, with a thermal conductivity of 200-300W/(m·K), which can quickly conduct heat and adapt to the heat dissipation needs of electronic equipment.

Application fields cover water electrolysis hydrogen production and electronic heat dissipation scenarios: in proton exchange membrane (PEM) water electrolysis hydrogen production, it is used as a bipolar plate or electrode carrier, and its high conductivity and porous structure are used to improve hydrogen production efficiency and gas diffusion performance; in electronic equipment heat dissipation, such as new energy vehicle battery packs and high-power LED lamps, it is used as a heat dissipation substrate or heat dissipation structure to quickly export heat and reduce equipment temperature; in the field of catalyst carriers, precious metals or non-precious metal catalysts are loaded for catalytic reactions such as organic synthesis and waste gas treatment; in addition, it is applied to electromagnetic shielding, sound-absorbing materials and other scenarios, exerting the advantages of its porous structure and conductive performance.

In the future, foamed copper will further explore functional composite and structural innovation, such as compounding with ceramic materials to prepare thermally conductive and insulating foamed copper, or developing foamed copper with gradient pore structure to adapt to the fluid transmission needs of different scenarios. At the same time, the production cost will be optimized to promote its large-scale application in water electrolysis hydrogen production, electronic heat dissipation and other fields, providing material support for the development of energy and electronic industries.