Revolutionizing Protection: Ultra-Thin Electromagnetic Shielding Film for Premium Electronics

The high-density integration trend of high-end electronic devices has put forward strict requirements on the thickness and performance of electromagnetic shielding materials. As a representative of ultra-thin shielding materials, electromagnetic shielding film is meeting market demand through technological breakthroughs. Traditional electromagnetic shielding film has the problem of being difficult to balance thickness and shielding effectiveness. The new generation of products has achieved the unity of ultra-thinness and high performance through production process innovation.​

The core technology in the production and manufacturing process lies in "ultra-thin substrate selection + high-precision conductive layer deposition". Polyimide (PI) film with a thickness of 5-12μm is selected as the substrate. This substrate has excellent high temperature resistance and mechanical strength, and can maintain structural stability in an ultra-thin state; the conductive layer is deposited with copper or copper-nickel alloy by magnetron sputtering process. By precisely controlling the sputtering power and time, the thickness of the conductive layer is controlled at 0.1-0.5μm. While ensuring high conductivity, the total thickness of the film is controlled at 6-15μm, which is more than 30% thinner than traditional products. In addition, precision coating technology is introduced in the production process to coat an ultra-thin adhesive (thickness <1μm) on the surface of the conductive layer to improve the bonding performance of the film. The adhesive adopts a halogen-free and environmentally friendly formula, which meets the environmental requirements of high-end electronic devices.​

In terms of performance characteristics, the ultra-thin electromagnetic shielding film has three advantages: "ultra-thin and lightweight, high shielding effectiveness, and high compatibility". The film is thin and light, with a weight of less than 20g per square meter, which can adapt to high-density integrated electronic devices without occupying additional space; in the frequency range of 50MHz-10GHz, the shielding effectiveness can reach 65-85dB, which can effectively block high-frequency electromagnetic interference; it also has good temperature resistance (-20℃~+150℃) and chemical corrosion resistance, can adapt to the complex working environment of electronic devices, is compatible with various packaging materials, and does not affect the overall performance of the device.