Product

Copper foam has many attractive thermal-mechanical features, such as light weight, high strength, high rigidity, high conductivity, high specific surface area, high permeability and low manufacturing cost. Its unique three-dimensional (3D) open-cell network structure is characterized by high transmittance and permeability, strong heat transfer and heat dissipation, and good sound absorption performance.

Its porosity can be as high as 99%.

It has high transmittance

and small flow resistance.

Nowadays, copper foam is increasingly used in petrochemical engineering, aerospace, mechanical engineering, electrical engineering, chemical energy storage and other fields. Its application scenarios include template production, filtration, catalytic carrier, battery electrode and heat dissipation.

Copper foam is usually applied to a heat exchanger in commercial applications due to its high permeability and large surface area. In this application, heat is exchanged by forced convection. Therefore, how to enhance the thermal conductivity of copper foam has become the focus for thermal design engineers. The following two figures show the streamlines, fluid temperature distribution and the temperature distribution of copper foam during forced convective heat exchange with copper foam fins of different structures. It can be seen that there are significant differences in the heat exchange rate among copper foam fins of different structures.