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Copper-tin foam

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Copper-tin foam, as a current collector with a three-dimensional network structure, can alleviate the volume change of a tin-based alloy electrode during the charge-discharge process and improve the high-rate charge-discharge performance of the alloy electrode. The porous feature of copper foam is exploited to construct a negative electrode support structure capable of counteracting the mechanical damage caused by the volume change of an active tin material during the charge-discharge process of lithium iron batteries. The structure can also restrain the powdering and shedding of the active material due to volume expansion, the increase of electronic contact resistance between the active material and the substrate, as well as other adverse effects, ensuring that the material is stable during the charge-discharge process. The negative electrode material is produced by an advanced continuous electrodeposition technology, which produces electrode materials with good consistency and excellent cycle performance.

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(a) and (b) are SEM images of the cooper foam substrate. (c) and (d) are SEM images of the cooper-tin foam surfaces.



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The production process of copper-tin foam is shown as follows:


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Main specifications:

Material: Copper content 85 - 95%; Tin content 5 - 15%

Thickness: 1.0 - 4.0mm

Porosity: ≥95%

Pore density: 85 - 130PPI

Open cell rate: ≥95%

Surface density: 200 - 600g/m2


Copper-tin materials are widely used as lithium ion electrode materials:

 

 

Copper-tin materials are widely used as lithium ion electrode materials:

Smart phones

Microcomputers

Wearable devices

Portable cameras

Lighting tools

Energy storage equipment

Portable power sources

Trucks

Cars

Buses

Electric scooters


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